Scientist - Package Design Engineer

Scientist - Package Design Engineer

SAL - Silicon Austria Labs

Villach, Austria

From € 65.000 per year gross

Your future tasks include:

• Research and development of advanced packaging platforms (2.5D and 3D).
• Design and fabrication of Si/RDL interposers for photonic-electronic integration.
• Development of assembly design kits (ADK).
• Process development and integration of TSV fabrication into interposer platforms.
• Data analysis, modeling, and process optimization.
• Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
• Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
• Preparation of technical reports, scientific publications, and presentations.
• Preparation and submission of research funding proposals.

Your profile:

• MSc or PhD in Electrical Engineering or a related field.
• Strong expertise in WLCSP design and IC–Package–PCB co-design.
• Hands-on experience in cleanroom processing and microfabrication workflows.
• Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration.
• Solid understanding of, and practical experience in, TSV/TGV processing.
• Experience in photonic packaging and co-packaged optics integration is highly desirable.
• Familiarity with passive and active optical alignment techniques.
• Knowledge of heterogeneous integration, chiplets and advanced packaging concepts.
• Experience of working with photonic assemblies and optical testing/characterisation.
• Strong analytical skills and a structured approach to problem solving.
• Experience in collaborative R&D projects and proposal writing.
• Fluency in English; German is a plus.