PostDoc Position on Wafer Bonding Physics for 3D Chip Integration

PostDoc Position on Wafer Bonding Physics for 3D Chip Integration

University of Twente

Enschede, Netherlands

€ 4,241 - € 5,538 per month gross

Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked and interconnected to create faster, more compact and more energy-efficient semiconductor devices. However, the detailed mechanisms that determine bonding quality are still not sufficiently understood. In particular, the interplay between surface properties, wafer morphology, and the resulting bonding performance is still largely optimized empirically.

In this postdoctoral project, you will develop and validate experimental methods to study wafer bonding in a quantitative and physics-based way. You will work on wafer bonding measurements and combine these with advanced surface metrology. It is relevant to have experience with analysis techniques such as AFM, WLI, contact-angle, XPS, infrared metrology.

You will contribute to a scientifically challenging and industrially relevant topic, with the aiming at predictive relations between measurable wafer surface properties and bonding performance for next-generation 3D chip integration.

Your profile

• You have a PhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field;
• You have experience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor-related materials;
• You are familiar with one or more relevant characterization techniques, such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry, or related surface-analysis methods;
• You are interested in connecting experimental results to physical models and quantitative data analysis;
• You enjoy hands-on experimental work and are able to work accurately with advanced laboratory equipment;
• You have a creative mindset, work independently, and are motivated to address a challenging scientific problem with industrial relevance;
• You have a good team spirit and enjoy working in an interdisciplinary environment with academic and industrial partners;
• You are proficient in English and able to communicate your results clearly in meetings, reports, and scientific publications.