Senior Research Engineer - Wafer Bond

Senior Research Engineer - Wafer Bond

SAL - Silicon Austria Labs

Villach, Austria

From € 65.000 per year gross

Are you ready to drive cutting-edge wafer bonding technologies? Join our wafer-level packaging team and help pioneer innovative processes for bonding and debonding wafers, enabling the development of next-generation 3D and heterogeneous integration technologies.

Your future tasks include:

• Development and optimization of wafer bonding processes for advanced packaging and heterogeneous integration.
• Operation and ownership of wafer bonding equipment (wafer bond cluster line as well as stand-alone wafer bonder).
• Process development for permanent and temporary wafer bonding techniques such as metallic, adhesive, anodic, glass frit, hydrophilic and surface activated bonding (SAB).
• Pre-bond surface preparation including lithography, plasma activation, and wafer cleaning processes.
• Integration of bonding processes into microfabrication flows in cleanroom environment.
• Characterization of bonded interfaces using bond metrology tools (e.g. void inspection, strength testing, alignment accuracy).
• DOE planning, process control, and yield improvement.
• Data analysis and documentation of process performance.
• Contribution to internal and collaborative R&D project.
• Technical reporting and support in scientific publications.

Your profile:

• University degree in Microfabrication, Physics, Electronics, Materials Science or a related field.
• Minimum of five years' hands-on experience in cleanroom processing and semiconductor fabrication.
• Proven track record in wafer bonding process development and optimisation.
• Experience as a tool owner for wafer bonding systems (cluster tools are strongly preferred).
• Strong practical experience with lithography, plasma activation and wafer cleaning.
• Hands-on experience with both permanent and temporary bonding techniques.
• Solid knowledge of W2W and D2W bonding approaches (sequential and collective).
• Experience with multiple bonding technologies: anodic, glass frit, metallic, adhesive and SAB.
• Familiarity with bond characterisation and metrology techniques.
• Understanding of surface chemistry and interface physics relevant to bonding.
• Strong problem-solving skills and process-oriented thinking.
• Experience in DOE, statistical analysis and process control is advantageous.
• Ability to work independently in a clean room and as part of a multidisciplinary team.
• Fluency in English; German is a plus.