Senior Scientist - TSV- and Si-Interposer Technologies

Senior Scientist - TSV- and Si-Interposer Technologies

SAL - Silicon Austria Labs

Villach, Austria

Your future responsibilities

• R&D for 2.5 D silicon interposers, TSV technologies and 3D stacking;
• Design, layout and microfabrication of interposers and TSVs;
• Concept development, DOE planning, and characterization;
• Microfabrication and backend processing in cleanroom environment;
• Contributing with backend solutions to different industrial projects;
• Data analysis;
• Technical reporting and scientific dissemination;
• Project management.

Your profile

• M.Sc. (or higher) in physics, microsystems fabrication, power electronics and electronics engineering or relevant industrial experience;
• Over 3 years of working experience as a intergration scientist in cleanroom enivronment including hands-on experience with TSV processing;
• In-depth knowledge and hands-on experience with advanced packaging processes such as interposers, chiplets and TSVs;
• Good understanding of signal and power integrity in interposers;
• Familiarity with BGA, WLCSP, SiP, MCM, AiP, AoP, SoC design rules;
• Experience in project management and research funding proposals;
• Fluent oral and written communication skills in English, knowledge of German is a plus.

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