Scientist - Plasma Etching Process Development for Novel Materials
Scientist - Plasma Etching Process Development for Novel Materials
SAL - Silicon Austria Labs
Villach, Austria
Your future responsibilities
- Development of new dry etch processes for new materials with a state-of-the-art etching tool
- Thin film surface characterization (incl.SEM, EDX, ellipsometry, AFM, XPS)
- Design and execution of advanced experiments, data analyses, and process improvements
- Collaborate as part of the Thin Film Technologies Research Unit in Microsystems Division and SAL Microfab Division in ongoing projects by performing state-of-the-art investigations on dry etch processes and thin-film technology for diverse MEMS applications and beyond
- Understanding the scientific aspects of dry etch processes on the targeted material, and using them to improve the processes
- Performing data analysis using analytical calculations, modelling, and standard statistical methods
- Generating innovative ideas to improve etching processes.
- Working in advanced ISO5 clean room facility
- Project management
- Scientific communication, reporting of research results and drive technical innovation and IP generation
- Active contribution in the acquisition of new industrial, funded or service projects
- Applying scientific methodologies to the development of dry etch processes
- Following scientific methodology in analyzing and reporting of results
- Driving scientific publications (peer-reviewed papers, participation to conferences) regarding dry etch processes
Your profile
- PhD degree in material science, physics, chemical engineering, or related fields with a focus on plasma physics/chemistry and etching; material characterization
- Over 2 years of working experience on dry etch processes, including hands-on experience with etch equipment and process development in a cleanroom environment.
- Knowledge of Plasma-based atomic layer etching processes.
- Demonstrated experience with development of dry etch for new materials is an advantage
- Expertise on various techniques to characterize ultra-thin layers, including their thickness, surface energies, compositions, and morphologies (Ex. SEM, EDX, XRD, Ellipsometry, AFM, XPS etc.)
- Knowledge in semiconductor technologies and practical and professional experience in related cleanroom microfabrication processes is a plus
- Excellent problem-solving skills and a creative mindset for developing innovative solutions
- Strong communication skills and ability to collaborate effectively in a team environment
- Excellent proficiency in written and spoken English
- Willingness to relocate to Villach, Austria
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